Wire Bonding in Microelectronics PDF ePub eBook

Books Info:

Wire Bonding in Microelectronics free pdf The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies - completely updated. Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. "Wire Bonding in Microelectronics", Third Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, and more.

About George Harman

George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.

Details Book

Author : George Harman
Publisher : McGraw-Hill Professional
Data Published : 01 March 2010
ISBN : 0071476237
EAN : 9780071476232
Format Book : PDF, Epub, DOCx, TXT
Number of Pages : 432 pages
Age + : 15 years
Language : English
Rating :

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